Xilinx Kintex UltraScale FPGA delivering high logic density and DSP throughput for AI acceleration, signal processing and wired communications.
Product Overview
The XCKU040-2FFVA1156I is a Xilinx Kintex UltraScale device built on the 20 nm UltraScale architecture. It provides a large array of system logic cells, abundant Block RAM and high DSP-slice count, making it well suited to computationally intensive workloads such as AI/ML preprocessing, high-speed signal processing, and line-rate packet handling. The -2 speed grade and industrial temperature range suit deployment in communications, test equipment and industrial acceleration cards. Quantitative resources should be confirmed against the official Xilinx datasheet for your exact design.
Key Features
- – Xilinx Kintex UltraScale 20 nm architecture
- – High system-logic density for complex designs
- – Large Block RAM and UltraRAM hierarchy for buffering
- – High DSP-slice count for math-intensive pipelines
- – Integrated high-speed serial transceivers (refer to datasheet)
- – Industrial temperature range (-40°C to 100°C)
- – 1156-ball FCBGA package for high I/O count
Technical Specifications
| Parameter | Value |
|---|---|
| Series | Kintex UltraScale |
| Logic Cells | Verify with manufacturer datasheet |
| Block RAM | Verify with manufacturer datasheet |
| DSP Slices | Verify with manufacturer datasheet |
| High-Speed Serial Transceivers | Verify with manufacturer datasheet |
| Operating Temperature | -40°C to 100°C (industrial) |
| Package | 1156-FCBGA (FFVA1156) |
| Speed Grade | -2 |
| RoHS | Compliant (verify with manufacturer datasheet) |
Applications
AI / ML acceleration, High-speed signal processing, Wired communications, Test and measurement, Data-center offload, Industrial acceleration.
Why Choose Newfly Electronics
Newfly Electronics supplies the XCKU040-2FFVA1156I from ISO9001-verified sources with lot traceability. We provide MOQ flexibility for prototype and production volumes, cross-reference support during allocation, and full-board BOM consolidation. RoHS / REACH documentation is available on request; exact datasheet parameters are confirmed with the manufacturer before shipment.
FAQ
Q: Is this device suitable for AI inference?
A: UltraScale FPGAs are widely used to accelerate pre/post-processing and custom ML layers in edge and embedded systems.
Q: What package does it use?
A: The FFVA1156 — a 1156-ball fine-pitch FCBGA, suited to high I/O designs.
Q: Do you provide the full resource sheet?
A: We confirm logic, BRAM, DSP and transceiver counts against the official Xilinx datasheet for your exact ordering code.