Product Overview
The K4A8G165W from Samsung is an 8 Gbit DDR4 SDRAM organized as 512 M × 16. The x16 organization serves processors and FPGAs needing wide memory buses, and the 8 Gb density is a mainstream capacity for server, networking and embedded compute designs.
Key Features
- 8 Gb density, 512M × 16 organization
- DDR4 architecture with bank groups
- 1.2 V operation
- x16 bus width for wide-bus processors and FPGAs
- 96-ball FBGA package
Technical Specifications
| Parameter | Value |
|---|---|
| Manufacturer | Samsung |
| Part number | K4A8G165W-BCRC |
| Density | 8 Gb |
| Organization | 512M × 16 |
| Type | DDR4 SDRAM |
| Supply voltage | 1.2 V |
| Speed grade | DDR4-3200 (BCRC) |
| Package | 96-ball FBGA |
Applications
- Servers and workstations
- AI compute modules
- Networking equipment
- FPGA memory subsystems
Why Choose Newfly Electronics
- Verified sourcing from original manufacturers and authorized channels
- Full traceability with date codes and batch documentation
- MOQ flexibility — samples, small batches, and production volumes
- Cross-reference and alternative-part service across brands
- Export documentation and worldwide shipping support
- Fast quotations within one business day
Contact sales@newflyelectronics.com or WhatsApp +86 15112635657 for current stock, pricing and datasheet support on K4A8G165W-BCRC.
FAQ
Q: What does the BCRC suffix mean?
A: It is Samsung’s speed/power grade designator for this 3200 MT/s class part.
Q: Can you supply Micron or SK hynix equivalents?
A: Yes — cross-brand equivalents are available with the same density and organization.
Q: Is this part suitable for FPGA designs?
A: The x16 organization is popular with FPGA memory controllers that need wide buses.
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